物料参数
| Product Lifecycle: | 推荐用于新设计 |
| Package: | 14-SOIC_N-150_MIL,Thin Shrink Small-Outline Package |
| # of Amps: | 4 |
| GBP (typ): | 5MHz |
| BW -3 dB (typ): | 5MHz |
| Slew Rate (typ): | 3.8V/us |
| Vos (max): | 5µV |
| VNoise Density (typ): | 9nV/rtHz |
| Ibias (max): | 600pA |
| Rail to Rail: | Output |
| Iq/Amp (typ): | 420µA |
| Iq/Amp (max): | 550µA |
| Vs span (min): | 2.7V |
| Vs span (max): | 36V |
| Shutdown: | No |
| Amp Features: | CMOS Inputs |
| Package Area: | 33.405mm² (Thin Shrink Small-Outline Package) (MAX44243AUD+)mm² |
| Eval / Ref Circuit: | Evaluation board |
| Export Classification: | EAR99 |
| Automotive: | No |
| Temp Range: | -40 to 125°C |
| Package Finish Code: | E3 |
| Package Height: | 1.1mm (Thin Shrink Small-Outline Package) (MAX44243AUD+)mm |
| Launch Date: | 2012-09-14 |
| Terminal Finish: | E3 |
| Temp Range Code: | A |
| EP: | No |
| Design Tools: | LTspice |
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